Lead free solder wire is a low residue cored solder designed for no-clean soldering applications that must meet all appropriate specifications. The unique blend of rosin and proprietary activators provide rapid wetting, while leaving minimal, optically clear, completely inert residue.
High-performance, fast wetting cored wires that meets the most reliability criteria.
☆ For all hand and automated soldering, component attach and rework operations
☆ Minimal, non-corrosive flux residues for high soldering efficiency
☆ Good solder ability, strong joints
☆ Excellent wetting properties and strong solder joints without spatter, minimal flux residue and no corrosiveness.
| Alloy composition | Melting point （℃） |
Product form |
|||||||
Solidus Line |
Liquidus Line |
Solder Bar |
Solder wire |
Paste |
Cored wire |
Solder Ball |
Preform |
||
Sn-58Bi |
139 |
● |
● |
||||||
Sn-1.0Ag-35Bi |
139 |
183 |
● |
● |
● |
||||
Sn-0.3Ag-35Bi |
139 |
183 |
● |
● |
|||||
Sn-2.5Ag-1.0Bi-0.5Cu |
214 |
215 |
● |
● |
● |
||||
Sn-30Bi-0.5Cu |
139 |
186 |
● |
||||||
Sn100 |
232 |
● |
● |
● |
● |
||||
Sn-0.7Cu |
227 |
● |
● |
● |
● |
||||
Sn-5.0Sb |
240 |
243 |
● |
● |
● |
● |
● |
||
Sn-10Sb |
245 |
263 |
● |
● |
● |
● |
|||
Sn-3.5Ag |
221 |
● |
● |
● |
|||||
Sn-3.0Ag-0.5Cu |
217 |
220 |
● |
● |
● |
● |
● |
● |
|
Sn-1.0Ag-0.5Cu |
217 |
224 |
● |
● |
● |
● |
● |
● |
|
Sn-0.3Ag-0.7Cu |
217 |
227 |
● |
● |
● |
● |
● |
● |
|
Sn-2.0Ag-6.0Cu |
217 |
380 |
● |
||||||
Sn-0.3Ag-0.7Cu-2Bi-X |
211 |
224 |
● |
● |
● |
||||
Sn-3.5Ag-0.7Cu-3Bi-X |
210 |
215 |
● |
● |
● |
||||
We can meet the requirements of other specifications | |||||||||
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